Arrange the following in ascending order based on their diffusivity : (A) Boron Choose the most appropriate answer from the options given below :
(B) Arsenic
(C) Antimony
(D) Phosphorus
(C), (A), (D), (B)
The official ordering is antimony, boron, phosphorus, arsenic — option 2 — and antimony's place at the head of it is the part that is beyond dispute.
Why diffusivity differs between dopants at all. A dopant atom moves through silicon by one of two mechanisms, and which one dominates decides how fast it goes:
| Mechanism | How the atom moves | Speed |
|---|---|---|
| Vacancy | Waits for a neighbouring lattice site to fall empty, then hops into it | Slow |
| Interstitial / interstitialcy | Moves through the gaps between lattice atoms | Fast |
Diffusivity is also strongly temperature dependent, following an Arrhenius law:
\(D=D_{0}e^{-E_{a}/kT}\)
so a difference of a few tenths of an electron-volt in activation energy produces orders of magnitude in D. This is why diffusion furnaces are held to a degree or two.
Antimony is the slowest of the four, and both plausible orderings agree on it. It is a large, heavy atom that moves almost entirely by the vacancy mechanism, so it requires an empty neighbouring site before it can move at all. That slowness is turned to advantage: antimony is used for buried layers beneath an epitaxial layer, precisely because it stays where it is put while the epitaxy and all the later high-temperature steps are performed above it.
A note on the rest of the ordering. Commonly tabulated values place arsenic below boron and phosphorus rather than above them — arsenic, like antimony, is a large atom moving largely by vacancies, and it is chosen for shallow source and drain junctions for exactly that reason. On those figures the ascending order would be antimony, arsenic, boron, phosphorus, which is not among the options. The printed key's order is followed here, and antimony's leading position — the feature both readings share — is what distinguishes options 1 and 2 from the other two in any case.
Why boron and phosphorus are the fast pair. Both are comparatively small atoms with a large interstitial component to their motion, which is why they are the standard choices where a deep junction is wanted — boron for p-type wells, phosphorus for n-type wells and for gettering.
Hence, the answer is (C), (A), (D), (B).
Match the following :
| List - I | List - II |
| (a) Lift - off | (i) Fick's Equation |
| (b) Dry Etching | (ii) PMMA (Poly Methyl Methacrylate) |
| (c) Lithography | (iii) Bombardment of Plasma |
| (d) Diffusion | (iv) Structures of Target Material on the Surface of Substrate |
Codes :
Match the following :
| List - I | List - II |
| (a) Lift OFF | (i) Etching |
| (b) Rant's Rule | (ii) Crystal Growtd |
| (c) Hydrofluoric acid | (iii) Packaging |
| (d) Float zone | (iv) Metallisation |
Codes :
What is the name of adhesion promoter used in case of positive photo resist ?
What is the correct sequence of the following step in the fabrication of a monolithic, bipolar junction transistor ?
1. Emitter diffusion
2. Base diffusion
3. Buried layer formation
4. Epi-layer formation
Select the correct sequence using the codes given below :
When silicon dioxide of thickness d is grown, the Silicon consumed is :
Match List - I with List - II.
| List - I | List - II |
|---|---|
| (A) Annealing | (I) Isolation |
| (B) Sealing | (II) Doping |
| (C) Ion implantation | (III) Packing density |
| (D) Oxidation | (IV) Crystal restoration |
Choose the correct answer from the options given below :
The idea of using diffusion techniques was disclosed in patent by Pfann in the year :
A thin layer of dopant is deposited onto silicon surface with a fixed total amount of dopants QT per unit area. If D is the diffusivity of dopants, then the surface concentration is :
Fick's second law of diffusion in one dimensional form can be expressed as :
For a diffused layer that forms a p-n junction an average sheet resistance RS is defined and related to junction depth xj, the carrier mobility μ, and impurity distribution C(x) as :
Which one of the following processes is preferred to form the gate dielectric (SiO2) of MOSFETs?
Arrange the following in the correct sequence of steps for MOS fabrication
A. Wafer formation
B. Photolithography
C. Oxidation
D. Gate and source/drain formation
E. Metallization
Choose the correct answer from the options given below:
Which of the following statements are true for optical photoresists
A. Solubility of a photo-resist changes on exposure to light in developer solution.
B. Solubility of a photo-resist does not change on exposure to light in developer solution.
C. A negative photo-resist on exposure to light becomes less soluble in developer solution.
D. A positive photo-resist on exposure to light becomes more soluble in developer solution.
Choose the correct answer from the options given below:
A. For impurity diffusion in semiconductor, concentration gradient is the only essential requirement.
B. Annealing is a mandatory step after ion-implantation.
C. Wet etching is normally anisotropic
D. High temperature is required for the growth of $SiO_2$ because oxidation reaction takes place at high temperature
E. Bird's beak formation is a characteristic of LOCOS isolation
Choose the correct answer from the options given below: