Particle beam lithography is an advanced technique used in micro- and nanofabrication to create intricate patterns on surfaces. It utilizes a focused beam of energetic particles, such as electrons or ions, to selectively modify a target material or resist layer. The resolution of this process refers to the minimum feature size or the smallest distance between distinct pattern elements that can be reliably created.
Achieving high resolution in particle beam lithography is critical for manufacturing smaller and more powerful electronic components and devices. Several factors contribute to the achievable resolution:
The question specifically asks about the dependence of resolution on the mass (denoted as $m$) and velocity (denoted as $v$) of the nano particles. These properties fundamentally determine the beam's momentum ($p = mv$) and kinetic energy ($E_k = \frac{1}{2}mv^2$).
Therefore, the achievable resolution is directly linked to the fundamental properties of the particles, namely their mass and velocity, as these govern the beam's focusability and interaction characteristics.
Based on the fundamental properties governing beam behavior and interaction, the resolution in particle beam lithography is considered to depend upon the mass and velocity of the nano particles.
A. For impurity diffusion in semiconductor, concentration gradient is the only essential requirement.
B. Annealing is a mandatory step after ion-implantation.
C. Wet etching is normally anisotropic
D. High temperature is required for the growth of $SiO_2$ because oxidation reaction takes place at high temperature
E. Bird's beak formation is a characteristic of LOCOS isolation
Choose the correct answer from the options given below:
Arrange the given process steps in sequence for self-aligned gate formation.
A. Thermal oxidation to grow gate oxide.
B. Polysilicon deposition
C. Photolithography using gate mask
D. Etching of polysilicon and oxide
E. Source/drain diffusion
Choose the correct answer from the options given below:
| LIST-I | LIST-II |
| A. Shallow trench isolation (STI) | I. Low static power dissipation |
| B. Junction isolation | II. High static power dissipation |
| C. CMOS technology | III. High component density |
| D. Bipolar IC technology | IV. Low component density |
Given below are two statements: one is labelled as Assertion A and the other is labelled as Reason R
Assertion A: Impurity diffusion in semiconductor essentially needs very high temperature.
Reason R: Diffusivity of impurity atoms is negligibly small at room temperature.
In the light of the above statements, choose the most appropriate answer from the options given below
When silicon dioxide of thickness d is grown, the Silicon consumed is :