To form the integrated circuits, VLSI technology uses
transistors
What VLSI means. Integrated circuits are classified by the number of active devices fabricated on one chip: SSI (a few gates, tens of devices), MSI (hundreds), LSI (thousands), and VLSI — Very Large Scale Integration, from tens of thousands up to the billions of devices on a modern processor.
The device being integrated. The count that defines all of those levels is a count of transistors. Every logic gate, flip-flop, SRAM cell, and analog block on a chip is built from transistors — in practice the MOSFET, used in complementary (CMOS) pairs, and the BJT in bipolar and BiCMOS processes. The transistor is the only element that provides both switching and amplification, and it can be scaled to nanometre dimensions while still working, which is precisely what makes very large scale integration possible (the observation behind Moore's law).
Why the other options are not the answer. Diodes can certainly be fabricated on-chip — as ESD protection, as p–n junction isolation between devices, or as the parasitic junctions inside every MOSFET — but they cannot provide gain and are not the building block whose count defines integration density. Switches is a function, not a fabricated element; on a chip a switch is realised by a transistor (e.g. a CMOS transmission gate). Vacuum tubes are bulky, fragile, high-power thermionic devices from the pre-semiconductor era and cannot be integrated onto a silicon die at all — replacing them was the reason the transistor was invented in 1947.
Takeaway. Chip technology is named after the density of the transistors it can integrate, and CMOS transistors are the fundamental active element of every VLSI circuit.
Hence, VLSI technology forms integrated circuits primarily using transistors.
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
In VLSI Design flow,
A. Algorithm describes the behaviour of target chip.
B. Architecture of processor is not mapped onto the chip surface by floor planning.
C. Behavioral domain defines FSMs.
D. Individual modules are implemented with leaf cells.
Choose the correct answer from the options given below:
The correct design flow of VLSI is :
A. Functional Design & verification
B. Circuit Design & verification
C. Logic Design & verification
D. Physical Design
E. Layout verification
Choose the correct answer from the options given below :
Assertion (A) : E-beam lithography is used for drawing nanostructures.
Reason (R) : E-beam lithography has high resolution than photo lithography.
Select your answer using the codes given below :
Microprocessor development had happened because of LSI. What is LSI ?
When exposed to light, the positive resists in developer solution responds by becoming :
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
In VLSI Design flow,
A. Algorithm describes the behaviour of target chip.
B. Architecture of processor is not mapped onto the chip surface by floor planning.
C. Behavioral domain defines FSMs.
D. Individual modules are implemented with leaf cells.
Choose the correct answer from the options given below:
The correct design flow of VLSI is :
A. Functional Design & verification
B. Circuit Design & verification
C. Logic Design & verification
D. Physical Design
E. Layout verification
Choose the correct answer from the options given below :