Microprocessor development had happened because of LSI. What is LSI ?
Large Scale Integration
LSI stands for Large Scale Integration — option 3. The other three are invented phrases; "integral" and "signal" have no place in the term, which is entirely about how many components share one chip.
The scale of integration is a count of devices per chip, and the sequence of names marks the industry's progress:
| Term | Components per chip | Era | Typical product |
|---|---|---|---|
| SSI — Small Scale | 1 – 10 gates | 1960s | 7400 series gates |
| MSI — Medium Scale | 10 – 100 gates | Late 1960s | Counters, decoders, multiplexers |
| LSI — Large Scale | 100 – 10,000 gates | 1970s | The 8080, 8085 and early memories |
| VLSI — Very Large Scale | 104 – 106 | 1980s | 80386, large SRAMs |
| ULSI — Ultra Large Scale | > 106 | 1990s onward | Modern processors, billions of transistors |
Why LSI in particular made the microprocessor possible. A CPU needs an ALU, a register file, an instruction decoder and timing logic. Built from SSI and MSI packages it filled a circuit board, and the interconnections between packages dominated its cost, size, power and delay. Once several thousand transistors could be placed on a single die, the whole processor fitted in one 40-pin package — and the Intel 4004 of 1971, with about 2,300 transistors, was exactly that.
The enabling technology was silicon-gate MOS: MOSFETs are smaller than bipolar transistors, need no isolation diffusions, and dissipate far less power, so many more could be packed together without the chip overheating.
The driving observation behind the whole table is Moore's law — the count doubling roughly every two years — which is what carried the industry from a few gates to the billions of transistors on a present-day die.
Hence, LSI stands for Large Scale Integration.
To form the integrated circuits, VLSI technology uses
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
In VLSI Design flow,
A. Algorithm describes the behaviour of target chip.
B. Architecture of processor is not mapped onto the chip surface by floor planning.
C. Behavioral domain defines FSMs.
D. Individual modules are implemented with leaf cells.
Choose the correct answer from the options given below:
The correct design flow of VLSI is :
A. Functional Design & verification
B. Circuit Design & verification
C. Logic Design & verification
D. Physical Design
E. Layout verification
Choose the correct answer from the options given below :
Assertion (A) : E-beam lithography is used for drawing nanostructures.
Reason (R) : E-beam lithography has high resolution than photo lithography.
Select your answer using the codes given below :
When exposed to light, the positive resists in developer solution responds by becoming :
To form the integrated circuits, VLSI technology uses
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
In VLSI Design flow,
A. Algorithm describes the behaviour of target chip.
B. Architecture of processor is not mapped onto the chip surface by floor planning.
C. Behavioral domain defines FSMs.
D. Individual modules are implemented with leaf cells.
Choose the correct answer from the options given below: