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Question

Microprocessor development had happened because of LSI. What is LSI ?

This question was previously asked in
UGC NET 2014 Paper 2 History Question Paper (28-Dec-2014)
The correct answer is

Large Scale Integration

 LSI stands for Large Scale Integration — option 3. The other three are invented phrases; "integral" and "signal" have no place in the term, which is entirely about how many components share one chip.

The scale of integration is a count of devices per chip, and the sequence of names marks the industry's progress:

TermComponents per chipEraTypical product
SSI — Small Scale1 – 10 gates1960s7400 series gates
MSI — Medium Scale10 – 100 gatesLate 1960sCounters, decoders, multiplexers
LSI — Large Scale100 – 10,000 gates1970sThe 8080, 8085 and early memories
VLSI — Very Large Scale104 – 1061980s80386, large SRAMs
ULSI — Ultra Large Scale> 1061990s onwardModern processors, billions of transistors

Why LSI in particular made the microprocessor possible. A CPU needs an ALU, a register file, an instruction decoder and timing logic. Built from SSI and MSI packages it filled a circuit board, and the interconnections between packages dominated its cost, size, power and delay. Once several thousand transistors could be placed on a single die, the whole processor fitted in one 40-pin package — and the Intel 4004 of 1971, with about 2,300 transistors, was exactly that.

The enabling technology was silicon-gate MOS: MOSFETs are smaller than bipolar transistors, need no isolation diffusions, and dissipate far less power, so many more could be packed together without the chip overheating.

The driving observation behind the whole table is Moore's law — the count doubling roughly every two years — which is what carried the industry from a few gates to the billions of transistors on a present-day die.

Hence, LSI stands for Large Scale Integration.

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Similar Questions

  1. To form the integrated circuits, VLSI technology uses

  2. The application of SiO2 in VLSI technology is mainly

    A. to use it as a 'Mask'.

    B. to provide electrical isolation.

    C. to provide surface activation.

    D. to provide electrical conduction.

    E. as a etching material.

    Choose the most appropriate answer from the options given below :

  3. Match List I with List II

    LIST I ( IC classification) LIST II (Number of transistors used)
    A. VLSII. 1000 \(\lt\) Number of transistors \(\lt\) 10,000
    B. MSIII. Number of transistors \(\gt\) 10,000
    C. LSIIII. Number of transistors \(\lt\) 100
    D. SSIIV. 100 \(\lt\) Number of transistors \(\lt\) 1,000

    Choose the correct answer from the options given below:

  4. In VLSI Design flow,

    A. Algorithm describes the behaviour of target chip.

    B. Architecture of processor is not mapped onto the chip surface by floor planning.

    C. Behavioral domain defines FSMs.

    D. Individual modules are implemented with leaf cells.

    Choose the correct answer from the options given below:

  5. The correct design flow of VLSI is :

    A. Functional Design & verification

    B. Circuit Design & verification

    C. Logic Design & verification

    D. Physical Design

    E. Layout verification

    Choose the correct answer from the options given below :

  6. Assertion (A) : E-beam lithography is used for drawing nanostructures.

    Reason (R) : E-beam lithography has high resolution than photo lithography.

    Select your answer using the codes given below :

  7. When exposed to light, the positive resists in developer solution responds by becoming :


Important Questions from VLSI Technology - Teaching

  1. In layout Design Rule, what should be the minimum width and spacing of metal and diffusion layers?
  2. To form the integrated circuits, VLSI technology uses

  3. The application of SiO2 in VLSI technology is mainly

    A. to use it as a 'Mask'.

    B. to provide electrical isolation.

    C. to provide surface activation.

    D. to provide electrical conduction.

    E. as a etching material.

    Choose the most appropriate answer from the options given below :

  4. Match List I with List II

    LIST I ( IC classification) LIST II (Number of transistors used)
    A. VLSII. 1000 \(\lt\) Number of transistors \(\lt\) 10,000
    B. MSIII. Number of transistors \(\gt\) 10,000
    C. LSIIII. Number of transistors \(\lt\) 100
    D. SSIIV. 100 \(\lt\) Number of transistors \(\lt\) 1,000

    Choose the correct answer from the options given below:

  5. In VLSI Design flow,

    A. Algorithm describes the behaviour of target chip.

    B. Architecture of processor is not mapped onto the chip surface by floor planning.

    C. Behavioral domain defines FSMs.

    D. Individual modules are implemented with leaf cells.

    Choose the correct answer from the options given below:

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