In VLSI Design flow, A. Algorithm describes the behaviour of target chip. B. Architecture of processor is not mapped onto the chip surface by floor planning. C. Behavioral domain defines FSMs. D. Individual modules are implemented with leaf cells. Choose the correct answer from the options given below:
A,C & D only
The question involves understanding the steps in the VLSI Design flow. Here is a detailed explanation for each statement provided:
Based on the analysis:
Therefore, the correct set of statements are A, C, and D.
Conclusion: The correct answer is A, C & D only.
To form the integrated circuits, VLSI technology uses
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
The correct design flow of VLSI is :
A. Functional Design & verification
B. Circuit Design & verification
C. Logic Design & verification
D. Physical Design
E. Layout verification
Choose the correct answer from the options given below :
Assertion (A) : E-beam lithography is used for drawing nanostructures.
Reason (R) : E-beam lithography has high resolution than photo lithography.
Select your answer using the codes given below :
Microprocessor development had happened because of LSI. What is LSI ?
When exposed to light, the positive resists in developer solution responds by becoming :
To form the integrated circuits, VLSI technology uses
The application of SiO2 in VLSI technology is mainly
A. to use it as a 'Mask'.
B. to provide electrical isolation.
C. to provide surface activation.
D. to provide electrical conduction.
E. as a etching material.
Choose the most appropriate answer from the options given below :
Match List I with List II
| LIST I ( IC classification) | LIST II (Number of transistors used) |
| A. VLSI | I. 1000 \(\lt\) Number of transistors \(\lt\) 10,000 |
| B. MSI | II. Number of transistors \(\gt\) 10,000 |
| C. LSI | III. Number of transistors \(\lt\) 100 |
| D. SSI | IV. 100 \(\lt\) Number of transistors \(\lt\) 1,000 |
Choose the correct answer from the options given below:
The correct design flow of VLSI is :
A. Functional Design & verification
B. Circuit Design & verification
C. Logic Design & verification
D. Physical Design
E. Layout verification
Choose the correct answer from the options given below :