Given below are two statements : Statement I : Concentration of acceptor atoms in the region between isolation islands in a monolythic integrated circuit will be much higher then in a p-type substrate. Statement II : The higher density is provided to prevent the depletion region of the reverse biased isolation to substrate junction from extending into the p+ type material. In the light of the above statements, choose the most appropriate answer from the options given below :
Both Statement I and Statement II are correct
To determine the accuracy of the given statements, we need to analyze each one related to monolithic integrated circuits and isolation techniques:
Thus, comparing both statements with the theoretical underpinnings of isolation in CMOS and similar technologies confirms that:
Correct Answer: Both Statement I and Statement II are correct.
Arrange the following fabrication steps in order needed to fabricate the IC :
(a) Oxidation (b) Etching (c) Metallization (d) Epitaxial growth
Codes :
Assertion (A) : In a bipolar IC fabrication, the diode isolation is used to isolate one device from the other.
Reason (R) : P+n diode used as isolation diode in IC fabrication.
Select your answer using the codes given below.
Assertion (A) : The epitaxial layer growth possesses the same crystal structure to that of the substrate on which it is grown.
Reason (R) : It can only be of similar conductivity type but possesses different value of resistivity to that of the substrate.
Select your answer using the codes given below.
In an npn diffused junction transistor, the p-type base region is formed on the n-type collector region through the process of :
Assertion (A) : The value of thin film resistor can be changed even after fabrication.
Reason (R) : This is done by means of trimming.
Select your answer using the codes given below.
The evaporation rate from a clean surface is related to the equilibrium vapour pressure Pe of the evaporating species of molecular weight M by an expression :
Czochralski (Cz) method is used instead of using float zone technique to grow Si crystal because it produces :
Czochralski system of crystal growth is a
MEMS devices are within the size range of
The thermal oxidation of silicon single crystal producer stacking faults lying on the plane.
Arrange the following fabrication steps in order needed to fabricate the IC :
(a) Oxidation (b) Etching (c) Metallization (d) Epitaxial growth
Codes :
Assertion (A) : In a bipolar IC fabrication, the diode isolation is used to isolate one device from the other.
Reason (R) : P+n diode used as isolation diode in IC fabrication.
Select your answer using the codes given below.
Assertion (A) : The epitaxial layer growth possesses the same crystal structure to that of the substrate on which it is grown.
Reason (R) : It can only be of similar conductivity type but possesses different value of resistivity to that of the substrate.
Select your answer using the codes given below.
In an npn diffused junction transistor, the p-type base region is formed on the n-type collector region through the process of :
As per the standards set by the Department of Telecom, Government of India, for all the new designs of mobile handsets, the permissible Specific Absorption Rate (SAR) limit is _______ averaged over 1 gram of human tissue with effect from 1st September 2012.