Assertion (A) : The gate of a MOSFET is insulated from body of FET by deposition of a very thin fragile layer of $\text{SiO}_2$ over the substrate.
Reason (R) : The device is therefore called an insulated gate field-effect transistor (IGFET).
In the light of the above statements, choose the most appropriate answer from the options given below :
In this question, we are given two statements: an Assertion (A) and a Reason (R). Our goal is to determine the relationship between them and select the most appropriate answer.
Assertion (A): The gate of a MOSFET is insulated from the body of FET by deposition of a very thin fragile layer of \(\text{SiO}_2\) over the substrate.
Reason (R): The device is therefore called an insulated gate field-effect transistor (IGFET).
Explanation:
Conclusion:
Thus, the correct answer is: Both (A) and (R) are correct and (R) is the correct explanation of (A).
| List - I (Addressing Modes) | List - II (Instruction) |
| A. Immediate Addressing | I. LDAX B |
| B. Register Addressing | II. OUT 01H |
| C. Direct Addressing | III. MVI B, 37H |
| D. Indirect Addressing | IV. MOV A, B |
| List - I | List - II |
| (Memory) | (Characteristic) |
| A. ROM | I. Volatile, Fast, Expensive |
| B. EPROM | II. UV erasable |
| C. EEPROM | III. Electrically erasable |
| D. SRAM | IV. Non-Volatile, permanent data |
| List - I | List - II |
| (Bus/Logic) | (Function/Characteristic) |
| A. Address bus | I. Carries read/write signals, timing signals, and interrupt signals |
| B. Data bus | II. A three-state output that can be high, low, or high-impedance |
| C. Control bus | III. Unidirectional lines used by CPU to point to a memory location or I/O device |
| D. Tristate logic | IV. Bidirectional lines used for transferring data between the CPU and memory |