The surface-mount soldering defect where unequal surface tension causes a chip component to lift vertically off one pad is known as __________, which can be mitigated during manual rework by using __________.
tombstoning; split-tip soldering iron
During reflow the two solder deposits under a small chip component can melt at slightly different instants; the pad that melts first pulls the component with its surface tension while the other end is still solid.
This unbalanced pull rotates the chip so that one end lifts vertically off its pad, standing the component upright like a gravestone — the defect called tombstoning (or the Manhattan effect).
To correct it during manual rework, both terminations must be heated and wetted at the same time so the surface-tension forces balance; a split-tip (tweezer/dual-point) soldering iron contacts both ends of the chip simultaneously.
The other pairings describe unrelated faults: de-wetting, cold joints and solder bridging are not the lifting-off defect, and their listed fixes do not equalise the pull on the two pads.
Hence, the answer is tombstoning; split-tip soldering iron.
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